@laptop2d I just saw your rant about companies not wanting to share their datasheets. I can empathize. We're using developing a product strictly for Motorola and they spec'd a particular processor that isn't usually spec'd for our product we're developing. We respun the board to meet the requirements they wanted which was no problem. The COM Express board that Motorola wanted was only sold by one vendor, again no problem. However, we asked this vendor for any schematics, datasheets, and specs.

(continued) The vendor refused to give that information to us. We explained to them that our company doesn't even make COM Express boards at all so competition was literally impossible. They still refused. We then told them that wouldn't mind signing an NDA to get these schematics, specs, etc. THEY STILL REFUSED. My VP blew up in their face and was literally yelling on the conference call about, and in his words, "bulls**t" it was that they refused to let us develop our products with...

(continued again) ... their COM Express module. We wouldn't be able to troubleshoot any SPI, I2C, PCIe, network, etc. signals coming from that COM Express for our product. Today, they've given us some "teasers" from their schematic but it doesn't even help since we don't even have a layout gerber to fully pinpoint where the signal is.

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@NickAlexeev I've only seen a package with solder ball joints on the bottom but not two rows of pads... That's really strange.

@KingDuken I've seen dual row QFNs before, although those are less common than BGAs.

But it's the first time I see a QFN with oblique inner pads [or whatever those are].

Very strange indeed... and to have them connected? Why have the other set at all then? Seems to me, no matter which set you chose to use, the other would be a "keepout" nightmare. I'll avoid such packages. If we all avoid it, maybe it will go away.

I suspect that since they're near the "minimum pitch" of a QFN at 0.5mm pin spacing, they can't just use the inner pins.

The die is only as big as the thermal pad, maybe a decent amount smaller

In the QFN packages I've seen, the leadframe doesn't extend very far into the package. Wirebonds from the outer ring of pads to the chip would be very long, and probably a lot of inductance, which the application may be sensitive to (HDMI)

So this is probably an economical way of extending the leadframe further into a QFN package, and still having support before the plastic is added

Hello, i have a hall effect sensor with part number of "503341" on it. how can i tell what kind of hall sensor it is to find the datasheet?

Google?

otherwise you're using a number that isn't necessarily the part number to identify a part

it gave me a whole lots of different datasheets from different hall effect sensors

i think it maybe is a ugn503 but i'm not sure tho

Another possibility is that it's a "standard" part number, and several manufacturers make something with the same number

how can i be sure?

@newbie how do you know it is a hall effect sensor?

i order some few years agp

ago*

ideally you could find match up marking on the package to markings on the datasheet, but it depends

so there's no way to make sure what exactly it is?

i found some pictures of ugn3503 with part number of 503518 written on it

but others have the 3503 number on it

i'm gonna use ugn3503 datasheet worst case i'm gonna burn the sensor lol

thanks guys bye

That might be as good as it gets :)