Have anyone seen a QFN package like that? Why does it have a second row of pads between the die attach pad and the pins? Is the second row extensions of the outer row pins?
@NickAlexeev Best guess it that the QFN package is pad-limited, and those wires lead to a closer bonding location. The BGA package is half the size (like 4.5mm vs. 9.0mm), so it's possible that's the lead frame extending out more.
